DPC Ceramic Substrate

The DPC（Direct Plating Copper, DPC）ceramic substrate adopts the DPC manufacturing process. The DPC ceramic substrate uses the direct copper plating (DPC) process, the substrate surface is metallized by evaporation, magnetron sputtering and other surface deposition processes. First, titanium is sputtered under vacuum conditions. , chromium and then copper particles, and finally thickened by electroplating, then the circuit production is completed by ordinary pcb process, and finally the thickness of the circuit is increased by electroplating/electroless plating deposition.

Advantages：

Small size,

Precise structure and Integrated design

High insulation, high thermal conductivity and heat resistance, low expansion

Application:

5G communication

Industrial RF

High power LED

hybrid integrated circuit

Material:

ALN

AL2O3

DBC Ceramic Substrate

DBC(Directly bonded copper)  substrate is coated on one or both sides of the highly insulating Al2O3 or AlN ceramic substrate, and then heated at a high temperature of 1065~1085°C to make the copper metal due to high temperature oxidation, diffusion and The Al2O3 material produces (Eutectic) eutectic melt, which bonds copper and gold to the ceramic substrate to form a ceramic composite metal substrate. Finally, according to the circuit design, the circuit is prepared by etching.

Advantages：

Good thermal performance

coefficient of thermal expansion matching with Si

Simple process

Strong adhesion

Strong current carrying capacity

 Application:

. 1. Insulated gate bipolar transistor (IGBT)

2. Automobile

3. Aerospace

4. Solar cells

5. Laser system

Material:

ALN

AL2O3

AMB Ceramic Substrate

Active Metal Bonding, active metal brazing copper clad technology，Active Metal Brazing, the active metal brazing process is a further development of the DBC process technology. It uses a small amount of active elements contained in the solder to react with ceramics to form a reaction layer that can be wetted by liquid solder, thereby realizing ceramics and ceramics. A method of joining metals.

Material:

ALN

Si3N4