--U.S. military data shows that 55% of the effectiveness of electronic devices is due to heat dissipation problems.

--As optoelectronics, radio frequency electronics, power chips and other devices develop towards high power and small size, thermal management issues become more difficult.

--As the best thermal conductive material in nature, diamond heat dissipation substrate will effectively reduce chip junction temperature and show great value in chip packaging and other fields.

Basic parameters of diamond heat dissipation materials

Parameter                                                                    Single crystal                   polycrystalline

Thermal conductivity (W/mK)                                           2200                               >1200

Thermal expansion coefficient (@300K, ppm/K)                1                                        1

Hardness (Gpa)                                                                70-120                                 81

Fracture toughness (Mpa m0.5)                                         5.3-7                                5.3-7

Young's modulus (Gpa)                                                      1050                                 1050

Density (1000Kg/m3)                                                          3.52                                   3.52

Dielectric constant (@35GHz)                                             5.68                                   5.68

Tangent loss (@145GHz 10^-6)                                           --                                    <100

Surface roughness                                                               <2nm                             Ra<20nm

Flatness                                                                       <1micron/mm                            --

Typical size                                                                       7*7mm                        2 inches (φ=50mm)

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※ Our company provides a variety of single crystal, polycrystalline and surface metallized diamond products for heat dissipation, and can provide surface metal film patterning services.

Metallized single crystal diamond

Thermal management

Thermal conductivity: 2200W/mK

Size: 7*7mm-15*15mm

Thickness: 0.05mm-3mm

Surface roughness: Ra<5nm

Polycrystalline diamond

Thermal management

Thermal conductivity>1200W/mK

Dimensions: 2 inches

Thickness: 0.1mm-1mm

Surface roughness: Ra<20nm

Single crystal diamond

Thermal conductivity: 2200W/mK

Size: 7*7mm-15*15mm

Thickness: 0.05mm-3mm

Surface roughness: Ra<5nm

More Application：

Optical Window

A.diamond material X-ray windows

B.diamond material High Power laser optical window,such as CO2 Laser ,disk laser

C.diamond material high power laser multispectral optical window

D. diamond material High-power millimeter-wave windows

Thermal Management

A.diamond material heat sink/submount

Semiconductor

A.diamond wafer 

B.GaN on diamond