Diamond is the material with the highest thermal conductivity in nature (1000~2000W/mk). It also has a low thermal expansion coefficient. By compounding with a copper matrix with good toughness, it can achieve high thermal conductivity, adjustable thermal expansion coefficient, and high strength. Effective combination, it is considered to be a thermal management material with great development potential.

Application

This material is a composite material with a sandwich structure. The core material is diamond and is clad with copper on both sides. Its expansion coefficient and thermal conductivity are designable. It is used for low expansion of heat sinks, lead frames, and multi-layer printed circuit boards (PCBs). floors and hot aisles.

SPEC

Thickness of Diamond Substrate :0.3-1mm

Thickness of Cu layer:50-200um

Thickness of Ni layer:0.5-5um

Thickness of Au layer:0.5-2um

Thermal conductivity: 600-800W/mk

Coefficient of thermal expansion(25°C-200°C):0.000004-0.000006/k